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A wafer bin map (WBM) is a visual representation of the spatial distribution of defective chips on a wafer. WBMs showing specific defect patterns are usually a result of process-assignable causes; thus, it is important to identify them to eliminate assignable causes. With advances in semiconductor manufacturing technology, identifying new defect patterns, and diagnosing their causes have become critical. However, most existing methods for WBM analysis use a supervised learning approach, which only detects previously known defect patterns. The similarity-search approach is a suitable alternative for defining new defect patterns. The proposed method uses an unsupervised approach to search for similar WBMs by measuring the similarities of three spatial features of defect patterns–shape, location, and size–which are useful for defining new defect patterns and diagnosing their causes. These three similarities are achieved using tensor voting and the mountain function for shape similarity, Euclidean distance for location similarity, and a combination of defect count and average radius for size similarity. The overall similarity was assessed using the weighted average of the three similarities. The weights are determined by quantifying the uncertainty of each similarity based on information entropy theory to better distinguish between similar patterns. The experimental results demonstrate the effectiveness of the proposed method compared to existing methods and highlight its capability to identify and describe the spatial features of defect patterns.